INTERNATIONAL SENSOR SYSTEMS, INC.AURORA, NEBRASKA
402-694-6111, Fax:402-694-6180
103 Grant St Aurora, NE 68818-3200
Company Information
- Contact Person:
WAYNE ROBLEE
- Contact Title:
President
- Year Established:
1973
- Business Type:
- Manufacturing (90 %)
- Service (10 %)
Products & Services
Manufactures thick film hybrid microcircuits, printed circuit board assemblies, surface mount circuit board assemblies, chip on board assemblies,
custom,custom package,custom manufacturing,custom electronic,electronic,custom electronic design,circuit design,circuit,circuit assembly,assembly,chip-on-board,chip on board,cob,hybrid,thick film,thick film hybrid,ic,laser trim,mcm,multichip module,multichip,pcb,printed circuit board,qfp,semiconductor,smt,surface mount,through-hole,through hole,abrasive trim,alumina,aluminum nitride,association connecting electronics industries,ansi,automatic placement,ball bonding,beryllia,burn-in,cad,capacitor,ceramic,cermet,chip,co-fired,computer aided design,conductors,conductive,conformal coat,contract manufacturing,design,die,die bond,dielectrics,dip,dual-in-line-package,dual in-line package,dual inline package,electrical test,electronic,engineering,environmental test,eutectic,film,fine pitch,firing,flex circuit,flip chip,gold,handsolder,high density interconnect,interconnect,input,inspect,integrated circuit,ipc,kevlar,laminate,layout,metalization,military standards,mil-std,miniaturization,module,multichip,multilayer,multi-layer,network,output,palladium silver,pick and place,pitch,plastic leaded chip carrier,plcc,plated through-hole,platinum gold,platinum silver,polymide,polymers,print,printed through hole,printed wire board,process control,proto-type,prototype,pth,pwb,quad flat pack,quality assurance,qa,qc,quality control,reflow,resistor,screen,services,silver,single-inline-package,single in-line package,single-in-line-package,sip,small outline integrated circuit,small outline package,soic,solder,sot,substrate,technology,high-tech,high tech,tcr,temperature coefficient resistance,test,thick,thick film inks,thick film pastes,thin small outline package,thin small-outline package,tsop,trimming,tsot,turnkey,wave,wave solder,wave-solder,wedge bonding,wire bonding
issi provides custom electronic design and manufacturing for a variety of industries, the u.s. military, and oems. international sensor systems offers five technologies - multichip module, thick film hybrid, chip-on-board, surface mount, and through-hole.
Keywords
- Electronic Assembly
- Hybrids
- Chip On Board
NAICS Code(s)
- 334220
- Radio and Television Broadcasting and Wireless Communications Equipment Manufacturing
- 334310
- Audio and Video Equipment Manufacturing
- 334418
- Printed Circuit Assembly (Electronic Assembly) Manufacturing