ADVOTECH COMPANY INCTEMPE, ARIZONA
480-736-0406, Fax:480-736-0206
632 W 24th St Tempe, AZ 85282-1930
Company Information
- Legal Structure:
Subchapter S Corporation
- Contact Person:
GEORGE G CROUCH
- Year Established:
1992
- Business Type:
- Manufacturing (30 %)
- Research and Development (10 %)
- Service (60 %)
- Ownership:
- Woman Owned
Products & Services
Semiconductor Assy, DieAttach, Epoxy/Eutectic, Wire Bond, Wedge, Ball, Ribbon, FlipChip, StudBumping, GlobTop, Sealing. PICK&PLACE, WafflePack, GelPak, Tape&Reel PACKAGING, RFID, Hybrids, IC, Photonics, MEMS, RF, Interactive Engr'g.
semiconductor, assembly, packaging, bga, pba, side, braze, lcc, epoxy, eutectic, die, attach, lid, wire, bond, bonder, bonding, gold, aluminum, au, al, ball, wedge, ribbon, conductive, non, hermetic, re-flow, esec, sikama, plasma, cleaning, automatic, manual, pcb, flip, chip, pick, place, waffle, gel, pack, pak, ball, testing, shear, pull, royce, profiling, oven, mems, back-end, dicing, dice, die, wafer, silicon, glass, quartz, pzt, fr4, disco, k&s, dad, 641, 7500, nitto, uv, exposure, 200 mm, ceramic, bumped, process, development, interactive, engineering, prototype, quick, turn, low, medium, volume, proof, concept, research, development, r&d, tempe, phoenix, arizona, az
advotech company inc. - located in tempe (phoenix) arizona. prototype to medium volume semiconductor assembly, packaging, and dicing service specializing in proof-of-concept and process development.
Special Equipment
Auto & Semi Auto Pick & Place Equipment
Keywords
- Semiconductor Assy
- Dieattach
- Epoxy/eutectic
- Wire Bond
- Wedge
- Ball
- Ribbon
- Flipchip
- Studbumping
- Globtop
- Sealing. Pick&place
- Wafflepack
- Gelpak
- Tape&reel Packaging
- Rfid
- Hybrids
- Ic
- Photonics
- Mems
- Rf
- Interactive Engr'g.
NAICS Code(s)
- 334413
- Semiconductor and Related Device Manufacturing
- 334418
- Printed Circuit Assembly (Electronic Assembly) Manufacturing
- 334419
- Other Electronic Component Manufacturing
