Nextek, Inc.MADISON, ALABAMA

Company Information

Products & Services

Nextek is a niche market; technology driven company, focused on offering precision electronic and optoelectronic assembly and engineering services for customers with needs-driven, non-commodity products.

electronic manufacturing services, high density interconnect, opto electronics assembly, photonics assembly, printed circuit assembly, printed circuit boards, printed circuit board design, design, pcb, routing, thermo compression bonding, emerging technology, plasma cleaning, pb-free, lead-free, pull testing, destructive testing, non-destructive testing, shear testing, high mix, wire bonding, low volume, dam and fill, laser profiling, wedge-bonding, glob top, die placement, flip chip, underfill, overmold, bga, bga assembly, opto-electronics, opto electronics, component design, dfm, gerber file generation, electrical design, microelectronics assembly, surface mount assembly, chip on board, flip chip assembly, fiber optic assembly, lvsem, xray, x-ray, sem, eds, edx, sem/eds, sem/edx, csam, sam, xrf, ionic contamination, metallurgical, cross-section, cross-sections, microscope, pcb cross-section, decap, decapsulation, ic decapsulation, failure analysis, pcb failure analysis, component failure analysis, ftir, paragon,industrial design, mechanical design, gse, ground support equipment, build to print, box build, prototype build, sla, sls, fdm, urethane casting, plastic injection mold, metal injection mold, sheetmetal, sheet metal ,enclosure development, fea, stess analysis, thermal analysis, motion analysis, cable & harness design, cable design, harness design,cnc tool path creation, mold design, proe, proengineer, mechanica, isdx, diagram,pro/intralink, pro intralink, surface modeling, solid modeling, assembly design, mechanism design, assembly animation, pcb design, root cause failure analysis, ground-up product development, integrted design solutions, value engineering, product enhancement, product styling, ergonomic design, product branding,functional modeling, concept, development, electronic enclosure design, enclosure design, human factors design, medical device design, medical product development, medical product manufacturing, consumer electronics design, produc

electronic manufacturing services for advanced technology,high density electronic assemblies

Special Equipment

Through Hole and Surface Mount Printed Circuit Board Assembly; Microelectronic Assembly; Optoelectronic Assembly; Analytical Laboratory; Class 10,000 Clean Room

Keywords

NAICS Code(s)