PCB FABRICATION AND ASSEMBLY OF HPSC PROCESSOR CARD

Location: Federal
Posted: Aug 7, 2026
Due: Aug 11, 2026
Agency: NATIONAL AERONAUTICS AND SPACE ADMINISTRATION
Type of Government: Federal
Category:
  • 59 - Electrical and Electronic Equipment Components
Solicitation No: 80NSSC26939777Q-R1
Publication URL: To access bid details, please log in.
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PCB FABRICATION AND ASSEMBLY OF HPSC PROCESSOR CARD
Active
Contract Opportunity
Notice ID
80NSSC26939777Q-R1
Related Notice
80NSSC26939777Q
Department/Ind. Agency
NATIONAL AERONAUTICS AND SPACE ADMINISTRATION
Sub-tier
NATIONAL AERONAUTICS AND SPACE ADMINISTRATION
Office
NASA SHARED SERVICES CENTER
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General Information
  • Contract Opportunity Type: Solicitation (Original)
  • Original Published Date: Aug 07, 2026 10:39 am CDT
  • Original Date Offers Due: Aug 11, 2026 03:00 pm CDT
  • Inactive Policy: 15 days after date offers due
  • Original Inactive Date: Aug 26, 2026
  • Initiative:
    • None
Classification
  • Original Set Aside: Total Small Business Set-Aside (FAR 19.5)
  • Product Service Code: 5998 - ELECTRICAL AND ELECTRONIC ASSEMBLIES, BOARDS, CARDS, AND ASSOCIATED HARDWARE
  • NAICS Code:
    • 334418 - Printed Circuit Assembly (Electronic Assembly) Manufacturing
  • Place of Performance:
Description

VENDORS MUST REFERENCE THE NOTICE ID WHEN SUBMITTING A PROPOSAL FOR THIS REQUIREMENT.



SEE THE ATTACHED SOW AND RFQ.


Attachments/Links
Contact Information
Contracting Office Address
  • JERRY HLASS ROAD, BLDG. 1111
  • STENNIS SPACE CENTER , MS 39529
  • USA
Primary Point of Contact
Secondary Point of Contact


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