J&A - Direct Bonding
| Location: | Virginia |
|---|---|
| Posted: | May 27, 2026 |
| Agency: | DEPT OF DEFENSE |
| Type of Contract: | Awards |
| Type of Government: | Federal |
| Category: |
|
| Solicitation No: | W56KGU26CA004 |
| Publication URL: | To access bid details, please log in. |
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Active
Contract Opportunity
Notice ID
W56KGU26CA004
Related Notice
Department/Ind. Agency
DEPT OF DEFENSE
Sub-tier
DEPT OF THE ARMY
Major Command
AMC
Sub Command
ACC
Sub Command 2
ACC-CTRS
Sub Command 3
ACC-APG
Office
W6QK ACC-APG
Award Details
General Information
Classification
Description
Contact Information
History
- Contract Award Date: May 18, 2026
- Contract Award Number: W56KGU26CA004
- Task/Delivery Order Number:
- Modification Number:
- Contractor Awarded Unique Entity ID:
- Contract Opportunity Type: Justification (Original)
- Original Published Date: May 27, 2026 02:09 pm EDT
- Inactive Policy: 30 days after published date
- Original Inactive Date: Jun 26, 2026
- Authority: FAR 6.302-1 - Only one responsible source (except brand name)
-
Initiative:
- None
- Product Service Code: AC13 - NATIONAL DEFENSE R&D SERVICES; DEPARTMENT OF DEFENSE - MILITARY; EXPERIMENTAL DEVELOPMENT
- NAICS Code:
-
Place of Performance:
Fort Belvoir , VAUSA
Redacted J&A for Direct Bonding for Compound Semiconductor for Use in Dual Band Infrared Focal Plane Arrays.
Attachments/Links
Contracting Office Address
- W6QK ACC APG DIVISION A 6472 INTEGRITY COURT
- ABERDEEN PROVING GROU , MD 21005-1846
- USA
Primary Point of Contact
- Hanh Dinh
- hanh.t.dinh.civ@army.mil
Secondary Point of Contact
- May 27, 2026 02:09 pm EDTJustification (Original)
Related Document
| May 27, 2026 | [Award Notice (Original)] Direct Bonding for Compound Semiconductor for Use in Dual Band Infrared Focal Plane Arrays |
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