Multichip Module Package for SiC Pressure Sensors
| Location: | Ohio |
|---|---|
| Posted: | Jun 27, 2026 |
| Due: | Jun 30, 2026 |
| Agency: | NATIONAL AERONAUTICS AND SPACE ADMINISTRATION |
| Type of Government: | Federal |
| Category: |
|
| Solicitation No: | 80NSSC26936730Q |
| Publication URL: | To access bid details, please log in. |
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- Contract Opportunity Type: Combined Synopsis/Solicitation (Original)
- Original Published Date: Jun 26, 2026 06:04 am CDT
- Original Date Offers Due: Jun 30, 2026 07:00 am CDT
- Inactive Policy: 15 days after date offers due
- Original Inactive Date: Jul 15, 2026
-
Initiative:
- None
- Original Set Aside:
- Product Service Code: 6695 - COMBINATION AND MISCELLANEOUS INSTRUMENTS
-
NAICS Code:
- 334419 - Other Electronic Component Manufacturing
-
Place of Performance:
Cleveland , OH 44135USA
** THIS IS A SOLE SOURCE REQUIREMENT ** for Multichip Module Package for SiC Pressure Sensors
- JERRY HLASS ROAD, BLDG. 1111
- STENNIS SPACE CENTER , MS 39529
- USA
- Shanna Patterson
- shanna.l.patterson@nasa.gov
- Jun 26, 2026 06:04 am CDTCombined Synopsis/Solicitation (Original)
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