Multichip Module Package for SiC Pressure Sensors
| Location: |
Ohio |
| Posted: |
Jun 27, 2026 |
| Due: |
Jun 30, 2026 |
| Agency: |
NATIONAL AERONAUTICS AND SPACE ADMINISTRATION |
| Type of Government: |
Federal |
| Category: |
- 66 - Instruments and Laboratory Equipment
|
| Solicitation No: |
80NSSC26936730Q |
| Publication URL: |
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Multichip Module Package for SiC Pressure Sensors
Active
Contract Opportunity
Notice ID
80NSSC26936730Q
Department/Ind. Agency
NATIONAL AERONAUTICS AND SPACE ADMINISTRATION
Sub-tier
NATIONAL AERONAUTICS AND SPACE ADMINISTRATION
Office
NASA SHARED SERVICES CENTER
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General Information
-
Contract Opportunity Type: Combined Synopsis/Solicitation (Original)
-
Original Published Date: Jun 26, 2026 06:04 am CDT
-
Original Date Offers Due: Jun 30, 2026 07:00 am CDT
-
Inactive Policy: 15 days after date offers due
-
Original Inactive Date:
Jul 15, 2026
-
Initiative:
Classification
-
Original Set Aside:
-
Product Service Code: 6695 - COMBINATION AND MISCELLANEOUS INSTRUMENTS
-
NAICS Code:
-
334419 - Other Electronic Component Manufacturing
-
Place of Performance:
Cleveland
,
OH
44135
USA
Description
** THIS IS A SOLE SOURCE REQUIREMENT ** for Multichip Module Package for SiC Pressure Sensors
Attachments/Links
Contact Information
Contracting Office Address
-
JERRY HLASS ROAD, BLDG. 1111
-
STENNIS SPACE CENTER , MS 39529
-
USA
Secondary Point of Contact
History
-
Jun 26, 2026 06:04 am CDTCombined Synopsis/Solicitation (Original)
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