NOTICE OF INTENT TO SOLE SOURCE: 300 mm Si wafer with Cu damascene patterns

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The United States Department of Commerce (DOC), National Institute of Standards and Technology (NIST), Acquisition Management Division (AMD) intends to negotiate, on a sole source basis, with AMAG Consulting, LLC, 221 FEATHERWOOD COURT, SCHENECTADY, NY 12303 for the purchase of one (1) 300 mm Si wafer with Cu damascene patterns to be utilized by NIST’s Microsystems and Nanotechnology Division (MND). The statutory authority for this acquisition is 41 USC 3304(a)(1); FAR 13.106-1(b).

***** Sole source determination is based on the need to acquire a quantity of one (1) 300 mm Si wafer with Cu damascene patterns to advance the CHIPS mission of developing imaging and measurement solutions for integrated circuit (IC) overlay metrology using a scanning electron microscope (SEM).

Minimum Requirements:

Description: 300 mm Si wafer with Cu damascene patterns

Quantity: 1

For the SEM overlay metrology project, NIST requires a 300 mm Si wafer sample of a set of chips with Cu damascene patterns suitable for research and development efforts to evaluate the feasibility of physics-based simulations and AI-based modeling as the means to improve the performance of SEM-based overlay metrology. 193 nm lithography shall be used to create the overlay metrology patterns. It is also advantageous, but not required to place other than overlay dimensional metrology patterns on the chips. All chips across the wafer shall be made identical, naturally occurring small variations due to fabrication processes are permitted.

Specifically, the Contractor shall provide one wafer containing at least 12 chips with the following overlay metrology parameters:

1. Cu damascene patterns with box-in-box (BiB), image-based overlay (IBO), advanced imaging metrology (AIM) grating patterns, and Hitachi-type SEM-based overlay (SBO). Pattern design can be found in pertinent public literature.

2. Sets of varying size BiB, IBO, AIM and SBO overlay metrology patterns must be included in the less than 150 mm to smaller than 50 mm range.

3. Overlay patterns with intentional, small, close to 1, 2, 5, and 10 nm variations of known overlay offsets (shifts) must be provided.

4. The wafer must be covered with a protective layer to safeguard the integrity of the Cu patterns.

5. A GDSII-based map with pattern locations and properties (size, type, offset, etc.) identification must be provided.

6. Documentation about the wafer material, dopant type and concentration, and the patterning process shall be provided.

Market Research was conducted in October and November of 2024, including internet searches, searches of GSA and Thomas Register, speaking with professional contacts, and reviewing company websites. Internet searches using google.com revealed several companies that are capable of manufacturing the required wafer, however they would require a photomask to manufacture the required wafer. Obtaining a photomask would require significant additional time and cost to obtain, making these options cost-prohibitive in this instance. Additionally, these companies will only manufacture the required wafers with a minimum order greater than one (1). Many other commercial wafer manufacturers sell wafers with no required patterns on them, and do not meet NIST's requirements for a Cu patterned wafer. AMAG Consulting is the only company that can make the required wafer, without a photomask, in the required quantity. This market research determined that AMAG Consulting is the sole manufacturer and distributor of the equipment that meets the required minimum specifications.

*****The North American Industry Classification System (NAICS) code for this acquisition is 334416 – Semiconductor and Related Device Manufacturing, with a small business size standard of 1,250 employees.

*****A determination by the Government not to compete the proposed acquisition based upon responses to this notice is solely within the discretion of the Government. Information received will be considered solely for the purpose of determining whether to conduct a competitive procurement.

*****No solicitation package will be issued. This notice of intent is not a request for quotations; however, all responsible sources interested may identify their interest and capability to respond to this requirement. Interested parties that believe they can satisfy the requirements listed above must identify their capability in writing before the response date of this notice. Only responses received by 11:00 a.m. Eastern Standard Time on January 29, 2025 will be considered by the government. Responses shall be submitted via email to jenna.bortner@nist.gov or ranae.armstrong@nist.gov.

Contracting Office Address:

100 Bureau Drive

Bldg. 301, Mail Stop 1640

Gaithersburg, Maryland 20899-0001

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