Request for Information: Next Generation Microelectronics Manufacturing 3DHI Microsystems
| Location: | Federal |
|---|---|
| Posted: | Jul 25, 2025 |
| Due: | Aug 29, 2025 |
| Agency: | DEPT OF DEFENSE |
| Type of Government: | Federal |
| Category: |
|
| Solicitation No: | DARPA-SN-25-93 |
| Publication URL: | To access bid details, please log in. |
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Active
Contract Opportunity
Notice ID
DARPA-SN-25-93
Related Notice
Department/Ind. Agency
DEPT OF DEFENSE
Sub-tier
DEFENSE ADVANCED RESEARCH PROJECTS AGENCY (DARPA)
Office
DEF ADVANCED RESEARCH PROJECTS AGCY
General Information
Classification
Description
Contact Information
History
- Contract Opportunity Type: Special Notice (Original)
- Original Published Date: Jul 25, 2025 06:11 pm EDT
- Original Response Date: Aug 29, 2025 05:00 pm EDT
- Inactive Policy: Manual
- Original Inactive Date: Aug 31, 2025
-
Initiative:
- None
- Original Set Aside:
- Product Service Code: AC12 - NATIONAL DEFENSE R&D SERVICES; DEPARTMENT OF DEFENSE - MILITARY; APPLIED RESEARCH
-
NAICS Code:
- 541715 - Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)
-
Place of Performance:
The Defense Advanced Research Projects Agency (DARPA) Microsystems Technology Office (MTO) seeks information to support a future solicitation. This “Design Challenge” solicitation is intended to advance the next generation of 3D heterogeneously integrated (3DHI) microsystems by enabling early access to the capabilities established under the Next Generation Microelectronics Manufacturing (NGMM) program. The prototypes developed through this effort will demonstrate the unprecedented performance of 3DHI microelectronics. Through this RFI, DARPA aims to solicit further insight into the classes of 3DHI microsystems that can best leverage the NGMM integration technology roadmap to support innovative commercial and/or dual use applications.
The goals of this Request for Information (RFI) include, but are not limited to:
• Identification of innovative applications that can leverage 3DHI
• Identification of organizations interested in utilizing NGMM’s 3DHI capability
• Identification of potential barriers to fabricating 3DHI components
• Identification of additional offerings that would further promote both the use of 3DHI and engagement with NGMM
The goals of this Request for Information (RFI) include, but are not limited to:
• Identification of innovative applications that can leverage 3DHI
• Identification of organizations interested in utilizing NGMM’s 3DHI capability
• Identification of potential barriers to fabricating 3DHI components
• Identification of additional offerings that would further promote both the use of 3DHI and engagement with NGMM
Attachments/Links
Contracting Office Address
- 675 NORTH RANDOLPH STREET
- ARLINGTON , VA 222032114
- USA
Primary Point of Contact
- MTO BAA Coordinator
- NGMM@darpa.mil
Secondary Point of Contact
- Jul 25, 2025 06:11 pm EDTSpecial Notice (Original)
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Bid Due: 6/12/2026
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