Direct Bonding for Compound Semiconductor for Use in Dual Band Infrared Focal Plane Arrays
| Location: |
Virginia |
| Posted: |
May 27, 2026 |
| Agency: |
DEPT OF DEFENSE |
| Type of Contract: |
Awards |
| Type of Government: |
Federal |
| Category: |
- 58 - Communications, Detection and Coherent Radiation Equipment
- A - Research and development
|
| Solicitation No: |
W56KGU26CA004 |
| Publication URL: |
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Direct Bonding for Compound Semiconductor for Use in Dual Band Infrared Focal Plane Arrays
Active
Contract Opportunity
Contract Line Item Number
Department/Ind. Agency
DEPT OF DEFENSE
Sub-tier
DEPT OF THE ARMY
Major Command
AMC
Sub Command
ACC
Sub Command 2
ACC-CTRS
Sub Command 3
ACC-APG
Office
W6QK ACC-APG
Award Details
General Information
-
Contract Opportunity Type: Award Notice (Original)
-
Original Published Date: May 27, 2026 01:58 pm EDT
-
Inactive Policy: 15 days after contract award date
-
Original Inactive Date:
Jun 02, 2026
-
Initiative:
Classification
-
Original Set Aside:
-
Product Service Code:
-
NAICS Code:
-
Place of Performance:
Fort Belvoir
,
VA
USA
Description
Attachments/Links
Contact Information
Contracting Office Address
-
W6QK ACC APG DIVISION A 6472 INTEGRITY COURT
-
ABERDEEN PROVING GROU , MD 21005-1846
-
USA
Secondary Point of Contact
History
-
May 27, 2026 01:58 pm EDTAward Notice (Original)
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