| Location: | Illinois |
|---|---|
| Posted: | May 27, 2026 |
| Due: | |
| Agency: | DEPT OF DEFENSE |
| Type of Government: | Federal |
| Category: |
|
| Publication URL: | To access bid details, please log in. |
U.S. Army Combat Capabilities Development Command – Chemical Biological Center (DEVCOM CBC), Rock Island, IL, on behalf of the Office of the Secretary of Defense, Office of the Assistant Secretary of Defense for Industrial Base Policy Innovation Capability and Modernization office via its Industrial Base Analysis and Sustainment (IBAS) Program (10 U.S.C. § 4817), in conjunction with Army Contracting Command - Rock Island Arsenal (ACC-RIA), manages the Cornerstone Other Transaction Agreement (OTA), in accordance with 10 U.S.C. § 4022. Cornerstone was architected to create a broad-based, flexible and enduring public-private consortium focused on strategic strengthening of the U.S. Manufacturing and Defense Industrial Base and provide a strong complement to the mandates in Presidential Executive Order 13806.
ACC-RIA, on behalf of DEVCOM CBC and the Department of War (DoW), intends to issue a competitive Cornerstone Initiative Request (CIR) for Reshore Enhanced Secure Heterogenous Advanced Packaged Electronics (RESHAPE) 2.0 on or after 29 May 2026, with an estimated closing date of 30 days after issuance. The CIR for RESHAPE 2.0 is restricted to Cornerstone consortium members.
Subject to funding, the Cornerstone CIR will solicit prototype fixed-price proposals for multiple (4 to 10) Other Transaction Agreements (OTA) with incremental payments made upon completion of specific milestones. The period of performance is estimated to be 60 months. A non-competitive follow-on production OT may be awarded following a successful prototype.
Objective:
The objective of this effort is to develop a U.S.-owned, domestic, trusted, pure-play, and open-access Advanced Packaging Ecosystem Hub. This hub will focus on low-volume production of 2.5-D and 3-D Advanced System Integration and Packaging (ASIP) secure solutions. This initiative seeks to address critical gaps in the domestic microelectronics supply chain, reduce reliance on offshore manufacturing, and enhance the mission effectiveness of Department of War (DoW) systems.
Any OT awarded as a result of this initiative will incorporate the following clauses:
The CIR is restricted to Cornerstone Consortium members only and will be communicated to the Cornerstone Consortium and companies with pending applications via email. Entities are required to have begun the membership process for their proposal to be reviewed. Entities must have an active registration in SAM.gov, a favorable status in Federal Awardee Performance and Integrity Information Systems, and be members of the Cornerstone Consortium, with a signed Cornerstone Consortium Management Agreement, to be eligible to submit a proposal and be eligible for awarded this of an OTA task. Contractors may obtain Cornerstone registration information located at https://cornerstone.army.mil or by inquiring at: usarmy.ria.devcom-cbc.mbx.cornerstone-ota@army.mil.
Interested parties should stay alert for any changes that may be published to this sam.gov posting. Please email all questions and responses to the following mailbox: usarmy.ria.devcom-cbc.mbx.cornerstone-ota@army.mil
This Special Notice is for planning purposes only and does not constitute a CIR or an obligation on behalf of the U.S. Government. Issuance of this Special Notice is not a guarantee of a future CIR or an award and is not a commitment of any kind by the Government.

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