Secure Packaged Microelectronic Components, Printed Circuit Boards, and Supporting Technologies
| Location: | Federal |
|---|---|
| Posted: | Aug 17, 2026 |
| Due: | Sep 16, 2026 |
| Agency: | DEPT OF DEFENSE |
| Type of Government: | Federal |
| Category: |
|
| Solicitation No: | W52P1J26R0001 |
| Publication URL: | To access bid details, please log in. |
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Active
Contract Opportunity
Notice ID
W52P1J26R0001
Related Notice
Department/Ind. Agency
DEPT OF DEFENSE
Sub-tier
DEPT OF THE ARMY
General Information View Changes
Classification
Description
Contact Information View Changes
History
- Contract Opportunity Type: Special Notice (Updated)
- Updated Published Date: Aug 17, 2026 03:50 pm CDT
- Original Published Date: Aug 17, 2026 02:43 pm CDT
- Updated Response Date: Sep 16, 2026 05:00 pm CDT
- Original Response Date: Sep 16, 2026 05:00 pm CDT
- Inactive Policy: 15 days after response date
- Updated Inactive Date: Oct 01, 2026
- Original Inactive Date: Oct 01, 2026
-
Initiative:
- None
- Original Set Aside:
- Product Service Code: R425 - SUPPORT- PROFESSIONAL: ENGINEERING/TECHNICAL
-
NAICS Code:
- 541715 - Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)
-
Place of Performance:
USA
Refer to the Attachment, R2.0_SS_RFI_SUBMISSION_v1.2.
Attachments/Links
Primary Point of Contact
- Christopher Maurer
- christopher.s.maurer2.civ@army.mil
- Phone Number 5207142318
Secondary Point of Contact
- Aug 17, 2026 03:50 pm CDTSpecial Notice (Updated)
- Aug 17, 2026 02:43 pm CDT Special Notice (Original)
Related Document
| Aug 18, 2026 | [Special Notice (Updated)] Secure Packaged Microelectronic Components, Printed Circuit Boards, and Supporting Technologies |
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