Optical Microscope

Active

Contract Opportunity

Responses to Questions posed by Industry:

Q:There is no description of the “imaging modes”. Reflected light Brightfield is assumed, but does the user also want to have Darkfield and DIC?

A: Requirements for imaging modes are specified in points c, d, and h of the Technical Specifications, Section III Requirements, page 2 of the Statement of Requirements.

Q: A “motorized translational stage” is mentioned in the general description, but not in the requirements. There is no mention of whether the stage is encoded or not,

A: The motorized stage must include an integrated measuring system and rotation, as outlined in point i of the Technical Specification, Section III Requirements, page 2 of the Statement of Requirements.

Q: It also mentions that the samples will be cleaved from large wafers, but there is no XY size requirement for the stage.

A: The size of the XY stage is specified as 100 mm x 100 mm, see point i of the Technical Specification, Section III Requirements, page 2 of the Statement of Requirements.

Q: A camera is mentioned without any further specification

A: The camera details are specified in point n of the Technical Specifications, Section III Requirements, page 2 of the Statement of Requirements: at least 6 megapixels, a minimum FOV of 20 mm, and a pixel size better than 3.0 µm

Q: There is a mention of Image Analysis software but no mention of what the user wishes for it to do.

A: The software requirements are specified in the Software section, Section III Requirements, page 2 of the Statement of Requirements. These requirements will satisfy our needs.

Q: Encoded capability for the selected imaging modes:

A: Requirements for integrated X-Y-Z motorization and encoded capabilities are specified in points g, k, l, and m of the Technical Specifications and in point e of the Software section, Section III Requirements, page 2 of the Statement of Requirements.

Q: Issues with the objectives’ specifications.

A: We did not specify that our samples are flat. In general, they may come from wafers with less topographical variation, but in some cases, we alter the surface through various processes. Additionally, we may need to create active devices with contacts and wires attached to the cleaved pieces. All of these factors impose constraints on the working distances required for the objectives. These research needs were the main reason for our requirements.

Q: If 1mm is sufficient WD for a 100x objective, then why is 1mm not sufficient WD for a 50x objective?

A: Exceeding 1mm of WD is not necessary.

For our samples, we need a working distance as large as possible (given the numerical aperture) to facilitate easy manipulation and observation. The 50X objective is the one we are most likely to use for our sample inspections. In contrast, we expect to use the 100X objective less frequently, in cases that permit a more restrictive working distance of 1 mm. However, this shorter distance requires extra caution to avoid damaging the samples.

SOLICITATION 1333ND26QNB640568

OPTICAL MICROSCOPE

This is a solicitation for commercial items prepared in accordance with format in RFO Subpart 12.2, as supplemented with additional information included in this notice. This announcement constitutes the only solicitation; quotations are being requested, and a separate written solicitation document will not be issued.

This solicitation is a Request for Quotations (RFQ).

The associated North American Industrial Classification System (NAICS) code for this procurement is 334516 – Analytical Laboratory Instrument Manufacturing, with a Small Business size standard of 1,000 employees. This requirement is will be a Full and Open Competition.

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