NOTICE OF INTENT TO SOLE SOURCE for Extreme Thermal Cycling Chamber

Location: Maryland
Posted: Mar 12, 2025
Due: Mar 23, 2025
Agency: COMMERCE, DEPARTMENT OF
Type of Government: Federal
Category:
  • 59 - Electrical and Electronic Equipment Components
Solicitation No: ACQ0042339
Publication URL: To access bid details, please log in.
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NOTICE OF INTENT TO SOLE SOURCE for Extreme Thermal Cycling Chamber
Active
Contract Opportunity
Notice ID
ACQ0042339
Related Notice
Department/Ind. Agency
COMMERCE, DEPARTMENT OF
Sub-tier
NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY
General Information
  • Contract Opportunity Type: Special Notice (Original)
  • Original Published Date: Mar 12, 2025 03:47 pm EDT
  • Original Response Date: Mar 23, 2025 04:00 pm EDT
  • Inactive Policy: 15 days after response date
  • Original Inactive Date: Apr 07, 2025
  • Initiative:
    • None
Classification
  • Original Set Aside:
  • Product Service Code: 5961 - SEMICONDUCTOR DEVICES AND ASSOCIATED HARDWARE
  • NAICS Code:
    • 334413 - Semiconductor and Related Device Manufacturing
  • Place of Performance:
    Gaithersburg , MD 20899
    USA
Description

Notice of Intent to Noncompetitively acquire an extreme thermal cycling chamber



This notice is not a request for a quotation. A solicitation document will not be issued, and quotations will not be requested.



This acquisition is being conducted under the authority of FAR 13.106-1(b). The North American Industry Classification System (NAICS) code for this acquisition is 334413, Semiconductor Devices and Associated Hardware which has a small business size standard of 1,250 employees.

The National Institute of Standards and Technology (NIST) Infrastructure and Materials Group within Engineering Laboratory (EL) is seeking an extreme thermal cycling chamber to perform accelerated aging experiments as part of a study of long-term reliability of materials used in advanced packaging of semiconductor chips. This work is in support of the CHIPS Metrology program.



In support of the CHIPS Metrology program, reliability testing and modeling of polymeric components in advanced packaging for semiconductors will be studied and developed. These materials will include underfill epoxies, thermal interface materials, and redistribution layer components. Extensive material property characterization of these components and their interfacial properties during environmental exposure (e.g., temperature, humidity, thermal cycling) will be completed for accurate reliability modeling development. Inverse gas chromatography will be used to measure shifts in work of adhesion throughout the aging process as part of this work. The work of adhesion of films (and particulates as needed) will be measured on samples throughout the aging process. These properties will also be measured in samples under variable temperature and relative humidity to investigate the effects of these environmental factors on work of adhesion throughout the aging process.



The CHIPS Metrology program develops and advances cutting edge metrology capabilities for members of the US semiconductor manufacturing ecosystem. This NIST conducted research program works with device manufacturers, tool vendors, materials suppliers, and other organizations to address critical metrology gaps to spur innovation within seven grand challenge areas. For more information on CHIPS Metrology, please visit https://www.nist.gov/chips/research-development-programs/metrology-program



NIST conducted market research from Feburary to March 2025 to determine what sources could potentially meet NIST’s minimum requirements for an extreme thermal cycling chamber. This included searches on GSA; SAM; Thomas Register; surveying vendor websites; and issuance of a Sources Sought Notice on SAM.gov. Market research identified a few manufacturers of extreme thermal cycling chambers, but only one has an available extreme thermal cycling chamber that provides rapid enough thermal cycling (70C/min) within the required temperature range (minimum temperature of -100 °C or lower to maximum temperature of 200 °C or higher). Other available systems do not provide the required thermal ramp rates. The results of market research revealed that only ESPEC North America Inc (UEI: N61JEZXYKXN5) appears to be capable of meeting NIST’s requirements.



However, any sources that believe they are capable of meeting NIST’s minimum requirements are encouraged to respond to this notice by the response date to provide the following information at a minimum: Company Unique Entity Identifier (UEI) number in https://sam.gov; details about what your company is capable of providing that meets or exceeds NIST’s minimum requirements; whether your company is an authorized reseller of the product or service being cited and evidence of such authorization; and any other information that can help NIST determine whether this requirement may be competitively satisfied.



A determination by the Government not to compete the proposed acquisition based upon responses to this notice is solely within the discretion of the Government. Information received will be considered solely for the purpose of determining whether to conduct a competitive procurement. Only responses received by the offers due date and time of this notice will be considered by the government. Responses shall be submitted via email to nina.lin@nist.gov.


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  • US
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History
  • Mar 12, 2025 03:47 pm EDTSpecial Notice (Original)
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