UP-Microchip Packaging Cleanroom Renovation
| Location: | Pennsylvania |
|---|---|
| Posted: | Dec 11, 2024 |
| Due: | Jan 9, 2025 |
| Agency: | Pennsylvania State University |
| Type of Government: | State & Local |
| Category: |
|
| Solicitation No: | 00-08958.00 |
| Publication URL: | To access bid details, please log in. |
Construction of the new micro electronic systems packaging research laboratory.
The Semiconductor Research Corporation (SRC)’s Joint University Microelectronics Program 2.0 (JUMP 2.0) has announced the creation of a new Penn State-led Center for Heterogeneous Integration of Micro Electronic Systems (CHIMES).
The Semiconductor Research Corporation (SRC)’s Joint University Microelectronics Program 2.0 (JUMP 2.0) has announced the creation of a new Penn State-led Center for Heterogeneous Integration of Micro Electronic Systems (CHIMES). The focus of this research is to collaborate to advance the effective integration and packaging of semiconduction devices, chips, and other components. Two new advanced research facilities are required to support the EE Department’s new research goals. The purpose of this project is to complete the design of the new micro-electronic systems packaging research laboratory and determine the anticipated construction cost.
Contact Dennis Walter (dennis.walter@butz.com) and Tina Petrie (tina.petrie@butz.com) for Prequalification Criteria.
Contact Dennis Walter (dennis.walter@butz.com) and Tina Petrie (tina.petrie@butz.com) for RFP Documents.
All submissions shall be submitted electronically (.pdf) to Dennis Walter (dennis.walter@butz.com) , Dave Sillner (David.sillner@butz.com) , Scott Erney (Scott.Erney@butz.com) , Julie Patrick (jat280@psu.edu) , Jesse Wells (jgw124@psu.edu) , and Todd Webber (tdw16@psu.edu) .
With GovernmentContracts, you can:
- Find more opportunities and win more business
- Receive daily alerts for all new bid opportunities
- Get contract opportunities matched to your business
See also
..., prioritization, decision-making, and supervisory effectiveness across engineering and landscape architecture... consultant-provided engineering ...
City of Philadelphia
Bid Due: 6/23/2026
...Renovations for Radiologic Science and Engineering Program Labs, Classrooms, Offices, Common Spaces... Build ...
Pennsylvania State University
Bid Due: 6/16/2026
...the professions of architecture or engineering are requested to send one copy of ...
VETERANS AFFAIRS, DEPARTMENT OF
Bid Due: 6/22/2026