Photolithography Exposure System

The U.S. Army Medical Research Institute of Chemical Defense (USAMICD) requires a photolithography exposure system which could be a mask aligner or a direct laser writer (also known as a “maskless” aligner). It shall have a UV light source that passes light through an inserted photomask onto a substrate coated in photoresist. The system shall be able to align this projected pattern precisely with the substrate being exposed. The UV light wavelength shall be compatible with SU-8 photoresist (365nm). Operating parameters shall be digitally controlled with a programmable logic controller system or included computer. Created patterns shall be repeatable with a resolution of 2 microns or less. The system shall be able to expose an area up to and including that of a standard 6” wafer. It shall be capable of both soft and hard contact exposure. The system will be used for prototyping electrode designs with precise features. It should not require a clean room to operate.