Notice of Intent to Sole Source for High-Performance 3D Digital Image Correlation (DIC) System

Location: Maryland
Posted: Jul 1, 2026
Due: Jul 15, 2026
Agency: COMMERCE, DEPARTMENT OF
Type of Government: Federal
Category:
  • 66 - Instruments and Laboratory Equipment
Solicitation No: NB305000-26-01460
Publication URL: To access bid details, please log in.
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Notice of Intent to Sole Source for High-Performance 3D Digital Image Correlation (DIC) System
Active
Contract Opportunity
Notice ID
NB305000-26-01460
Related Notice
NIST-SS26-CHIPS-46
Department/Ind. Agency
COMMERCE, DEPARTMENT OF
Sub-tier
NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY
Office
DEPT OF COMMERCE NIST
General Information
  • Contract Opportunity Type: Special Notice (Original)
  • Original Published Date: Jul 01, 2026 01:35 pm EDT
  • Original Response Date: Jul 15, 2026 02:00 pm EDT
  • Inactive Policy: 15 days after response date
  • Original Inactive Date: Jul 30, 2026
  • Initiative:
    • None
Classification
  • Original Set Aside: No Set aside used
  • Product Service Code: 6640 - LABORATORY EQUIPMENT AND SUPPLIES
  • NAICS Code:
    • 334516 - Analytical Laboratory Instrument Manufacturing
  • Place of Performance:
    Gaithersburg , MD 20899
    USA
Description

Notice of Intent to Noncompetitively acquire upgrade a 3D Digital Image Correlation (DIC) System.



This notice is not a request for a quotation. A solicitation document will not be issued, and quotations will not be requested.



This acquisition is being conducted under the authority of FAR 12.102(b). The North American Industry Classification System (NAICS) code for this acquisition is 334516, Analytical Laboratory Instrument Manufacturing which has a small business size standard of 1,000 employees.

The NIST Infrastructure and Materials Group within the Engineering Lab, representing the CHIPS R&D Grand Challenge 3, has a requirement at its Gaithersburg, Maryland campus for a high-performance 3D DIC system. This system will precisely measure in-situ, full-field displacement and strain of polymeric packaging compounds (e.g., underfills redistribution layers, and thermal interface materials) under various thermal and mechanical loading conditions. This will meet the mission of enabling the characterization of advanced packaging integration and providing new open-source reliability tools.



In order to realize this mission, NIST requires a 3D DIC system that meet all minimum technical specifications identified below:



Line Item 0001: Description: 3D DIC System (Cameras, Controller, Software, and Workstation) (Quantity: 1 System)




  1. Imaging Device (Camera and Sensor) Specifications


    1. Must include at least 4 cameras of 12-megapixels or higher resolution.

    2. Minimum resolution of 4096 x 3000 pixels.

    3. Frame rate

      1. Minimum frame rate of 25 Hz at full resolution (e.g., 4096 x 3000 pixels).

      2. Extendable for full-format measuring areas of variable dimension (e.g., 20 x 15 mm2 to 1800 x 1500 mm2). Specify area limits.





  2. Measuring Volume and Lens Specifications

    1. Specify working distance (e.g., 350 mm).

    2. Local measurements

      1. Local measuring area, number of lenses, and focal length must be specified. Specify supported measurement area range limits.

      2. Preferred measurement area of approximately 30 x 25 mm2 to 250 x 180 mm2.

      3. Must be able to provide measurement of interposer structure.



    3. Global measurements

      1. Global measuring area, number of lenses, and focal length must be specified. Specify supported measurement area range limits.

      2. Preferred measurement area of approximately 65 x 50 mm2 to 650 x 480 mm2.

      3. Must be able to provide measurement of larger samples including larger assembly of test structures.



    4. Calibration objects

      1. System must include calibration objects suitable for a variety of measuring area ranges.

      2. Specify number of calibration objects and their associated measuring area ranges.





  3. Illumination and Projection Specifications

    1. LED illumination: Dual LED panels suitable for continuous operation

    2. Speckle-free capability: The system must include a digital pattern projector (LCD or similar) to project controlled, non-physical speckle patterns onto reflective/monotonic surfaces for warpage measurement.



  4. Controller

    1. Analog data acquisition: Must include an analog data acquisition system. Specify number of channels, resolution, voltage range, and sample rate. Minimum of 8 channels, 16-bit resolution, +/- 10 V, and minimum sample rate of 800,000 values/s preferred, although other specifications will be considered.

    2. Analog data output must be provided for real-time analysis. Specify number of channels that can be used in parallel along with resolution, voltage range, and frequency.

    3. Specify connectivity requirements (e.g., number of required Ethernet ports).



  5. Workstation

    1. A workstation for operation and data analysis must be included.

    2. Provide workstation specifications including processer, memory, storage, and operating system.



  6. Software

    1. Comprehensive software suite for image processing, calibration, image acquisition, correlation processing, and post-processing.

    2. Software for chamber control.





Line Item 0002: Mid-size Environmental Chamber (Quantity: 1)






  1. Dimensions

    1. Internal: Minimum of 20” W x 20” H x 20” D to accommodate larger samples and support lower magnification measurements with wider field of view.

    2. Specify maximum measurement dimensions. Minimum of 15” x 15” measurable size required.

    3. Specify test volume.



  2. Thermal control

    1. Minimum temperature range of -175 ºC to 300 ºC required.

    2. Specify heating and cooling ramp rates.



  3. Power requirements must be provided.



Line Item 0003: Small-Size Environmental Chamber (Quantity: 1)




  1. Dimensions

    1. Internal: Minimum of 8” W x 8” H x 8” D to accommodate smaller samples and support higher magnification measurements.

    2. Specify maximum measurement dimensions. Minimum of 4” x 4” measurable size required.

    3. Specify test volume.



  2. Thermal control

    1. Minimum temperature range of -175 ºC to 300 ºC required.

    2. Specify heating and cooling ramp rates.



  3. Power requirements must be provided.



NIST conducted market research in December 2025 to July 2026 to determine what sources could potentially meet NIST’s minimum requirements. This included searches on Google, GSA; SAM; surveying vendor websites; and issuance of a Sources Sought Notice on SAM.gov. Market research identified various manufacturers of 3D DIC systems, but only one can provide a commercial system providing integrated environmental chambers and a projector system necessary for in-situ 3D measurements required to study warpage and strain during long-term aging. The results of market research revealed that only Park Seungbae (UEI: K8ZQZ7N2LVT2) appears to be capable of meeting NIST’s requirements.



However, any sources that believe they are capable of meeting NIST’s minimum requirements are encouraged to respond to this notice by the response date to provide the following information at a minimum: Company Unique Entity Identifier (UEI) number in https://sam.gov; details about what your company is capable of providing that meets or exceeds NIST’s minimum requirements; whether your company is an authorized reseller of the product or service being cited and evidence of such authorization; and any other information that can help NIST determine whether this requirement may be competitively satisfied.



A determination by the Government not to compete the proposed acquisition based upon responses to this notice is solely within the discretion of the Government. Information received will be considered solely for the purpose of determining whether to conduct a competitive procurement. Only responses received by the offers due date and time of this notice will be considered by the government. Responses shall be submitted via email to nina.lin@nist.gov.


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Contact Information
Contracting Office Address
  • ACQUISITION MANAGEMENT DIVISION 100 BUREAU DR.
  • GAITHERSBURG , MD 20899
  • USA
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Secondary Point of Contact
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