Crystal Substrate Bonding Technologies and Algorithms (CRYSTAL)
| Location: |
Federal |
| Posted: |
Feb 14, 2025 |
| Due: |
Jun 16, 2025 |
| Agency: |
DEPT OF DEFENSE |
| Type of Government: |
Federal |
| Category: |
- A - Research and development
|
| Solicitation No: |
DARPA-EA-25-02-04 |
| Publication URL: |
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Crystal Substrate Bonding Technologies and Algorithms (CRYSTAL)
Active
Contract Opportunity
Notice ID
DARPA-EA-25-02-04
Department/Ind. Agency
DEPT OF DEFENSE
Sub-tier
DEFENSE ADVANCED RESEARCH PROJECTS AGENCY (DARPA)
Office
DEF ADVANCED RESEARCH PROJECTS AGCY
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General Information
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Contract Opportunity Type: Solicitation (Original)
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Original Published Date: Feb 14, 2025 03:31 pm EST
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Original Date Offers Due: Jun 16, 2025 04:00 pm EDT
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Inactive Policy: Manual
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Original Inactive Date:
Jul 16, 2025
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Initiative:
Classification
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Original Set Aside:
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Product Service Code: AC11 - NATIONAL DEFENSE R&D SERVICES; DEPARTMENT OF DEFENSE - MILITARY; BASIC RESEARCH
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NAICS Code:
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541715 - Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)
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Place of Performance:
Description
Bonded single crystal thin film multi-functional materials (electro-optic, acousto-electric, acousto-optic, magneto-optic or multi-ferroic materials) are vital for diverse sensing and communications technologies (integrated quantum, photonic, terahertz [THz], radio frequency [RF], and actuator platforms). Wafer bonding onto compatible substrates is the critical step for integrating single crystal thin films into multi-functional devices and systems. There is currently no method to analytically investigate wafer bonding processes. Brute force experimentation is required for initial process development, and subsequent changes in materials or device parameters necessitate significant additional trial and error, incurring huge costs, prolonging timeframes, thus limiting exploration of novel material systems.
Because there are no generalizable approaches to model wafer bonding between thin film crystals and substrates, wafer bonding process development remains highly empirical. As a result, the wafer bonding process is highly specific to select materials and device parameters and is limited by experimental knowledge to a small subset of known materials and device parameters. As an example, although lithium niobate on insulator (LNOI) exhibits promising piezo-electric and electro-optic properties, the lack of predictive wafer bonding models impedes development of novel applications and limits scalable integration. The ability to predictively model wafer bonding of thin film crystals would rapidly accelerate the research and development of multi-functional materials, and their fabrication and scalable integration in diverse applications.
This ARC Opportunity is soliciting ideas to explore the following question:
To accelerate development and integration of multi-functional materials, how do we create generalizable models to explore thin film crystal bonding onto suitable substrates under diverse real-world process conditions and parameters?
Attachments/Links
Contact Information
Contracting Office Address
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675 NORTH RANDOLPH STREET
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ARLINGTON , VA 222032114
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USA
Secondary Point of Contact
History
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Feb 14, 2025 03:31 pm ESTSolicitation (Original)
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