| Location: | Maryland |
|---|---|
| Posted: | Dec 23, 2024 |
| Due: | Jan 8, 2025 |
| Agency: | COMMERCE, DEPARTMENT OF |
| Type of Government: | Federal |
| Category: |
|
| Solicitation No: | NIST-SS25-CHIPS-0042 |
| Publication URL: | To access bid details, please log in. |
APEX Accelerators are an official government contracting resource for small businesses. Find your local APEX Accelerator (opens in new window) for free government expertise related to contract opportunities.
APEX Accelerators are funded in part through a cooperative agreement with the Department of Defense.
The APEX Accelerators program was formerly known as the Procurement Technical Assistance Program (opens in new window) (PTAP).
The purpose of this sources sought notice is to conduct market research and identify potential sources of commercial products/services that satisfy the Government’s anticipated needs.
BACKGROUND
The National Institute of Standards and Technology (NIST), Physical Measurement Laboratory (PML), Microsystems and Nanotechnology Division (MND), CHIPS R&D Program (https://www.nist.gov/chips/metrology-community) as part of the CHIPS Act activities, is now developing imaging and measurement solutions for integrated circuit (IC) overlay metrology using a scanning electron microscope (SEM). IC production relies on measurements of the 3D size, shape, and placement of structures with atomic-level precision and repeatability. The project will create a sound scientific foundation and comprehensive solutions for SEM-based overlay and dimensional metrology superior to currently used arbitrary methods. This will allow the design of overlay patterns, acquisition, and image analysis to be optimized entirely through artificial intelligence, physics-based simulation, and modeling and meet IC production requirements now and in the future.
NIST MND requires a wafer relevant to current IC technologies suitable for the SEM overlay measurements of Cu lines that can be covered with various Si oxide layers. Although this sample only approximates the complete overlay structure, it can be used to assess the advantage of using the physics of signal generation over simplistic methods that are not based on a physics model. The wafer containing many full-size chips will be diced into individual chips that will be covered by various thickness Si oxide layers at NIST NanoFab. The process will create a set of see-through overlay metrology samples needed for the SEM overlay metrology project.
NIST is seeking information from sources that may be capable of providing a commercial solution that will achieve the objectives described above, in addition to the following essential requirements:
For the SEM overlay metrology project, NIST requires a 300 mm Si wafer sample of a set of chips with Cu damascene patterns suitable for research and development efforts to evaluate the feasibility of physics-based simulations and AI-based modeling as the means to improve the performance of SEM-based overlay metrology. 193 nm lithography shall be used to create the overlay metrology patterns. It is also advantageous, but not required to place other than overlay dimensional metrology patterns on the chips. All chips across the wafer shall be made identical, naturally occurring small variations due to fabrication processes are permitted.
Specifically, the Contractor shall provide one wafer containing at least 12 chips with the following overlay metrology parameters:
1. Cu damascene patterns with box-in-box (BiB), image-based overlay (IBO), advanced imaging metrology (AIM) grating patterns, and Hitachi-type SEM-based overlay (SBO). Pattern design can be found in pertinent public literature; see, for example, [1] or elsewhere.
2. Sets of varying size BiB, IBO, AIM and SBO overlay metrology patterns must be included in the less than 150 mm to smaller than 50 mm range.
3. Overlay patterns with intentional, small, close to 1, 2, 5, and 10 nm variations of known overlay offsets (shifts) must be provided.
4. The wafer must be covered with a protective layer to safeguard the integrity of the Cu patterns.
5. A GDSII-based map with pattern locations and properties (size, type, offset, etc.) identification must be provided.
6. Documentation about the wafer material, dopant type and concentration, and the patterning process shall be provided.
HOW TO RESPOND TO THIS NOTICE
In responding to this notice, please DO NOT PROVIDE PROPRIETARY INFORMATION. Please include only the following information, readable in either Microsoft Word 365, Microsoft Excel 365, or .pdf format, in the response: Submit the response by email to the Primary Point of Contact and, if specified, to the Secondary Point of Contact listed in this notice as soon as possible, and preferably before the closing date and time of this notice. Please note that to be considered for award under any official solicitation, the entity must be registered and “active” in SAM at the time of solicitation response.
QUESTIONS REGARDING THIS NOTICE
Questions regarding this notice may be submitted via email to the Primary Point of Contact and the Secondary Point of Contact listed in this notice. Questions should be submitted so that they are received 5 days prior to the response date. If the Contracting Officer determines that providing a written amendment to this notice to document question(s) received would benefit other potential respondents, the questions would be anonymized, and a written response to such question(s) would be provided via an amendment to this notice.
IMPORTANT NOTES
This notice is for market research purposes and should not be construed as a commitment by NIST to issue a solicitation or ultimately award a contract. There is no solicitation available at this time.
This notice does not obligate the Government to award a contract or otherwise pay for the information provided in response.
NIST reserves the right to use information provided by respondents for any purpose deemed necessary and legally appropriate.
Any organization responding to this notice should ensure that its response is complete and sufficiently detailed to allow the Government to determine the organization’s capability.
Respondents are advised that the Government is under no obligation to acknowledge receipt of the information received or provide feedback to respondents with respect to any information submitted.
After a review of the responses received, a synopsis and solicitation may be published on GSA’s eBuy or SAM.gov. However, responses to this notice will not be considered an adequate response to any such solicitation(s).
Thank you for taking the time to submit a response to this request!

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