SMD_PS_RFQ_509319_ANALYSIS OF LEAD IN DUST WIPE SMPL & LEAD IN PAINT CHIPS SMPLS
| Location: | New York |
|---|---|
| Posted: | Dec 4, 2024 |
| Due: | Dec 18, 2024 |
| Agency: | City of New York |
| Type of Government: | State & Local |
| Category: |
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| Solicitation No: | 509319,1 |
| Publication URL: | To access bid details, please log in. |
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See also
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TRANSPORTATION, DEPARTMENT OF
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...with credit provided to USMMA, and encapsulation of any deteriorated lead-based paint identified...
TRANSPORTATION, DEPARTMENT OF
Bid Due: 8/03/2026
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