Multiple Award PCB Fab and Assembly BPAs 2026-2030

Location: Federal
Posted: Dec 1, 2025
Due: Dec 15, 2025
Agency: DEPT OF DEFENSE
Type of Government: Federal
Category:
  • 59 - Electrical and Electronic Equipment Components
Solicitation No: HQ072725QRT04
Publication URL: To access bid details, please log in.
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Multiple Award PCB Fab and Assembly BPAs 2026-2030
Active
Contract Opportunity
Notice ID
HQ072725QRT04
Related Notice
Department/Ind. Agency
DEPT OF DEFENSE
Sub-tier
DEFENSE MICROELECTRONICS ACTIVITY (DMEA)
Office
DEFENSE MICROELECTRONICS ACTIVITY
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General Information View Changes
  • Contract Opportunity Type: Combined Synopsis/Solicitation (Updated)
  • Updated Published Date: Dec 01, 2025 11:39 am PST
  • Original Published Date: Jul 24, 2025 01:55 pm PDT
  • Updated Date Offers Due: Dec 15, 2025 12:00 pm PST
  • Original Date Offers Due: Aug 15, 2025 02:00 pm PDT
  • Inactive Policy: 15 days after date offers due
  • Updated Inactive Date: Dec 30, 2025
  • Original Inactive Date: Aug 30, 2025
  • Initiative:
    • None
Classification
  • Original Set Aside: Total Small Business Set-Aside (FAR 19.5)
  • Product Service Code: 5998 - ELECTRICAL AND ELECTRONIC ASSEMBLIES, BOARDS, CARDS, AND ASSOCIATED HARDWARE
  • NAICS Code:
    • 334418 - Printed Circuit Assembly (Electronic Assembly) Manufacturing
  • Place of Performance:
    USA
Description View Changes

Re-solicitation of HQ072725QRT04



DMEA's mission includes developing electronics solutions that solve DOD obsolescence issues and/or provides state of the art SatCom solutions to DOD Programs. As such, there is a need to (1) rapidly produce developmental Printed Circuit Board Assemblies (PCBAs) for initial design and development use, (2) quickly produce prototype PCBAs for design validation, and (3) manufacture high quality PCBAs for use in DOD operational environments.



DMEA intends to competitively issue six BPA agreements to offerors based on three factors in the Proposal Instructions and Evaluation Criteria. DMEA anticipate fulfilling orders of Sixty (60) GrimWing units and Sixty (60) DireWing units using the BPAs.



Interested and capable PCB fabrication and/or PCB assembly vendors are highly encouraged to provide a proposal as instructed herein. Please see attached combined solicitation/synopsis, PWS for BPA scope, and the proposal

instructions and evaluation criteria. Phase I proposals are due to the contract specialist, Ryan Tung via e-mail to ryan.c.tung.civ@mail.mil, no later than 12:00pm (Pacific), Monday, 15 December 2025.






Attachments/Links
Contact Information View Changes
Contracting Office Address
  • DEFENSE MICROELECTRONICS ACTIVITY 4234 54TH STREET
  • MCCLELLAN , CA 956522100
  • USA
Primary Point of Contact
Secondary Point of Contact


History

Related Document

Jul 24, 2025[Combined Synopsis/Solicitation (Original)] Multiple Award PCB Fab and Assembly BPAs 2026-2030
Jul 25, 2025[Combined Synopsis/Solicitation (Updated)] Multiple Award PCB Fab and Assembly BPAs 2026-2030
Jul 29, 2025[Combined Synopsis/Solicitation (Updated)] Multiple Award PCB Fab and Assembly BPAs 2026-2030
Aug 15, 2025[Combined Synopsis/Solicitation (Updated)] Multiple Award PCB Fab and Assembly BPAs 2026-2030
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