UP-Microchip Packaging Cleanroom Renovation
| Location: | Pennsylvania |
|---|---|
| Posted: | Dec 7, 2024 |
| Due: | Jan 2, 2025 |
| Agency: | Pennsylvania State University |
| Type of Government: | State & Local |
| Category: |
|
| Solicitation No: | 00-08958.00 |
| Publication URL: | To access bid details, please log in. |
Construction of the new micro electronic systems packaging research laboratory.
The Semiconductor Research Corporation (SRC)’s Joint University Microelectronics Program 2.0 (JUMP 2.0) has announced the creation of a new Penn State-led Center for Heterogeneous Integration of Micro Electronic Systems (CHIMES).
The Semiconductor Research Corporation (SRC)’s Joint University Microelectronics Program 2.0 (JUMP 2.0) has announced the creation of a new Penn State-led Center for Heterogeneous Integration of Micro Electronic Systems (CHIMES). The focus of this research is to collaborate to advance the effective integration and packaging of semiconduction devices, chips, and other components. Two new advanced research facilities are required to support the EE Department’s new research goals. The purpose of this project is to complete the design of the new micro-electronic systems packaging research laboratory and determine the anticipated construction cost.
Contact Dennis Walter (dennis.walter@butz.com) and Tina Petrie (tina.petrie@butz.com) for Prequalification Criteria.
Contact Dennis Walter (dennis.walter@butz.com) and Tina Petrie (tina.petrie@butz.com) for RFP Documents.
All submissions shall be submitted electronically (.pdf) to Dennis Walter (dennis.walter@butz.com) , Dave Sillner (David.sillner@butz.com) , Scott Erney (Scott.Erney@butz.com) , Julie Patrick (jat280@psu.edu) , Jesse Wells (jgw124@psu.edu) , and Todd Webber (tdw16@psu.edu) .
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