Micro specimens of electroplated copper films and micro-sized lead-free solder...

Location:	Colorado
Posted:	Nov 18, 2025
Due:	Dec 3, 2025
Agency:	COMMERCE, DEPARTMENT OF
Type of Government:	Federal
Category:	A - Research and development
Solicitation No:	NIST-SS26-CHIPS-04
Publication URL:	To access bid details, please log in.

Micro specimens of electroplated copper films and micro-sized lead-free solder for mechanical testing to fracture

Active

Contract Opportunity

Notice ID

NIST-SS26-CHIPS-04

Related Notice

Department/Ind. Agency

COMMERCE, DEPARTMENT OF

Sub-tier

NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY

Office

DEPT OF COMMERCE NIST

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General Information

Classification

Original Set Aside: No Set aside used
Product Service Code: AJ12 - GENERAL SCIENCE AND TECHNOLOGY R&D SERVICES; GENERAL SCIENCE AND TECHNOLOGY; APPLIED RESEARCH
NAICS Code:
- 541713 - Research and Development in Nanotechnology
Place of Performance:
Boulder , CO 80305

USA

Description

Please see attached Sources Sought Notice (SSN)# NIST-SS26-CHIPS-04 for full details.

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History

Micro specimens of electroplated copper films and micro-sized lead-free solder for mechanical testing to fracture