Erate Networking Bid Proposal

Location:	Michigan
Posted:	Feb 21, 2026
Due:	Feb 27, 2026
Agency:	Delta Schoolcraft Intermediate School District
Type of Government:	State & Local
Category:	89 - Subsistence (Food)
Publication URL:	To access bid details, please log in.

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DSISD Consortium

2525 3rd Ave S

Escanaba, MI 49829

Request for Proposals

Network Electronics

Request For Proposal Year: 2026/2027

FY2026 E-Rate FORM 470 – 260022325

School District Contact:

Beau Boden, IT Director

Technology Department

Phone: 906.786.9300

E-mail: bboden@dsisd.net

Prepared by:

Triple R Consultants

P.O. Box 302

South Lyon, MI 48178

Phone: 810.923.9290

E-mail: bob@triple-r.us

DSISD Consortium

Contents

REQUEST FOR PROPOSALS – NETWORK ELECTRONICS ..................................................................................... 3

1.0.0 INVITATION TO BID........................................................................................................................................3

2.0.0 BIDDER INSTRUCTIONS................................................................................................................................. 3

3.0.0 GENERAL CONDITIONS ................................................................................................................................. 5

4.0.0 UNIVERSAL SERVICE FUND (USF) CONDITIONS ..................................................................................... 8

5.0.0 SCOPE OF WORK ............................................................................................................................................. 9

6.0.0 TIMELINE REQUIREMENTS......................................................................................................................... 10

7.0.0 AWARDED CONTRACT REQUIREMENTS................................................................................................. 11

PRODUCTS AND SERVICES SPECIFICATIONS....................................................................................................... 17

8.0.0 NETWORK ELECTRONICS SPECIFICATIONS........................................................................................... 17

9.0.0 SYSTEM DOCUMENTATION ....................................................................................................................... 20

APPENDIX A – INTENT TO BID FORM ..................................................................................................................... 21

APPENDIX B – BID SIGNATURE PAGE .................................................................................................................... 22

APPENDIX C – BILL OF MATERIALS TOTALS ....................................................................................................... 23

APPENDIX D - FAMILIAL DISCLOSURE AFFIDAVIT ............................................................................................ 24

APPENDIX E - IRAN LINKED BUSINESS AFFIDAVIT............................................................................................ 25

APPENDIX F – PREVAILING WAGE.......................................................................................................................... 26

FY2026-NetworkElectronics RFP-260022325

2/20/2026

Any other use of this property requires expressed written permission by Triple R Consultants.

DSISD Consortium

REQUEST FOR PROPOSALS – NETWORK ELECTRONICS

1.0.0

1.1.0

1.2.0

1.3.0

1.4.0

2.0.0

2.1.0

INVITATION TO BID

BID ACCEPTANCE

DSISD Consortium, hereby known as “District”, will accept sealed responses (“Bids”) to this Request for Proposals

(RFP) for Network Electronics projects which comply with the Invitation to Bid, Bidder Instructions, General

Conditions, Universal Service Fund (USF) Conditions, Scope of Work, Timeline Requirements, Awarded Contract

Requirements, and Products and Services Specifications set forth below and submitted to the District at the following

address:

DSISD Consortium

Network Electronics - FY2026 USF Bid

Administration Building – Attention: Beau Boden

2525 3rd Ave S

Escanaba, MI 49829

INTENT TO BID FORM

All Bidders must complete and submit the Intent to Bid Form, Appendix A, no later than

February 27, 2026. The Bidder shall be responsible for the timely delivery of the Intent to Bid Form. The Bidder

shall make no additional stipulations on the Intent to Bid Form or qualify their Bid in any other manner.

FACILITIES/BUILDING WALKTHROUGH

There are no walkthroughs scheduled for this RFP.

ADDENDUM QUESTIONS

All Bidders must complete and submit all major addendum questions by February 27, 2026.

BIDDER INSTRUCTIONS

BID OPENING

All Bid responses to this RFP must be in duplicate in a sealed opaque envelope labeled as follows:

Network Electronics - FY2026 USF Bid and “March 20, 2026”. The bidder must also upload a complete electronic

copy of their bid on the Triple R bidder portal no later than 2:00 PM, March 20, 2026. The bidder must contact

Jeremy Flores at jeremy@triple-r.us to request access into the bidder portal for bid submission.

2.1.1 No oral, telephonic, telegraphic, e-mail or facsimile Bids will be considered.

2.1.2 No Bids will be considered after 2:00 PM, March 20, 2026.

2.1.3

The Bidder shall be responsible for the timely delivery of the Bid; the District shall not be liable to any Bidder

for any delivery or postal delays and postmarking to the bid opening date will not substitute for receipt of the

Bid.

2.1.4

All timely submitted Bids received by the District will be opened at the Administration Building, 2525 3rd

Ave S, Escanaba, MI 49829 at 2:00 PM, March 20, 2026 for recommendation to the Board of Education

at a future regularly scheduled meeting.

2.1.5

If the District is closed due to unforeseen circumstances on the bid opening date, Bids will still be opened

using the bidder portal for all properly submitted bids uploaded to the bidder portal by 2:00 PM, March

20, 2026. The district must receive the paper copy from the bidder within three days of the bid opening

date or the bid is subject to rejection.

FY2026-NetworkElectronics RFP-260022325

2/20/2026

Any other use of this property requires expressed written permission by Triple R Consultants.

DSISD Consortium

2.2.0

2.3.0

BID BONDS

The Bidder shall submit a five percent (5 %) Bid Bond, of the total base Bid price, made payable to DSISD

Consortium, with the sealed Bid. No Bid Bond is required if the total base Bid price is less than thirty-one

thousand three-hundred and twenty-one dollars ($31,321.00). Any Bids for $31,321.00 or more received without

a Bid Bond will be rejected by the District.

CLARIFICATIONS AND CORRECTIONS

Direct any and all questions regarding this RFP by email to: Beau Boden at: bboden@dsisd.net. The resulting

answers, along with the questions shall be posted on USAC website.

2.4.0

2.5.0

GENERAL REQUIREMENTS

2.4.1 The District or its representatives shall not be held responsible for expenses incurred in the preparation or

subsequent presentation of the Bid response.

2.4.2 This RFP for Network Electronics is not an offer to enter into a contract, but rather a solicitation for Bids.

2.4.3 The Bidder shall supply, upon request, samples and/or brochures of the proposed materials and equipment

with the Bid.

2.4.4 There are no drawings associated with this RFP.

2.4.5

The District reserves the right to reject Bids submitted without a five percent (5%) Bid Bond, signed Bid

Signature Page, Bill of Materials, Familial Disclosure Affidavit, Iran Linked Business Affidavit, and a list of

four (4) references.

BID IDENTIFICATION REQUIREMENTS

The Bid shall include the full legal name of the Bidder, its business address, telephone number, and a statement

identifying the Bidder as a sole proprietorship, partnership, corporation, or other legal entity. A proprietorship shall

state the full name of the proprietor, a partnership shall state the full names of the general partners, and a corporation

shall identify the state in which it is incorporated. Each copy of the Bid shall be signed by the person or persons

legally authorized to bind the Bidder to a contract.

2.5.1 The Bidder shall complete and submit, along with the Bid, a Bid Signature Page, Appendix B, in long hand,

in ink, by an authorized representative.

2.5.2 The Bidder shall complete and submit, along with the Bid, a Bill of Materials, Appendix C, summarizing the

details of the Bid.

2.5.3

The submitted Bid shall include a Familial Disclosure Affidavit form, Appendix D, which is properly

completed, signed by an authorized representative of the Bidder and notarized with an affixed, raised notary

seal.

2.5.4

The submitted Bid shall include an Iran Linked Business Affidavit form, Appendix E, which is properly

completed, signed by an authorized representative of the Bidder and notarized with an affixed, raised notary

seal.

2.5.5 The submitted Bid shall include a list of at least four (4) references, one (1) of which must be a school or

school district, for similar work performed within the past three (3) years.

FY2026-NetworkElectronics RFP-260022325

2/20/2026

Any other use of this property requires expressed written permission by Triple R Consultants.

DSISD Consortium

2.6.0

DEFINITIONS

The foregoing definitions are made available for the purpose of this Request for Proposals (RFP) only.

2.6.1 District – DSISD Consortium

2.6.2 Bidder(s) – Business Entities and/or Person(s) submitting the Bid.

2.6.3 Bid(s) – A complete and properly executed proposal to perform the Scope of Work, or designated portion

thereof, for the sums stated within the Bid.

2.6.4 Base Bid – The sum stated in the Bid for which the Bidder offers to perform the Scope of Work wherein

work may be added or subtracted for sums stated in the Alternate Bid, if any.

2.6.5 Alternate Bid – An amount stated in the Bid to be added or subtracted from the amount of the Base Bid, if

said change in the Scope of Work, method of construction and/or materials is accepted by the District.

2.6.6 Selected Vendor/Contractor – The Bidder(s) receiving formal notice of acceptance of his/her Bid(s) and

has been duly served by an officer or agent of the District duly authorized to give such notice.

3.0.0

3.1.0

3.2.0

3.3.0

3.4.0

3.5.0

GENERAL CONDITIONS

RIGHTS OF ACCEPTANCE OR REJECTION

The District’s Board of Education reserves the right to reject any and all Bids in whole, or in part, and accept any Bid

or portion of the Bid that, in their opinion, best serves the interests of the District.

QUALIFICATION OF BIDDERS

For the purpose of assuring the District of the quality of workmanship, materials, products and/or services, the Board

of Education will retain the right and has complete discretion to qualify or disqualify any Bidders on the basis of

available information concerning the Bidder’s ability to perform as needed and the suitability of the products and/or

services included in the Bid as described in sections 3.4.0 and 3.5.0. Each Bidder, by submitting a Bid, represents

that:

3.2.1 The Bidder has read and understands all the Bid requirements, conditions and specifications contained herein.

3.2.2 The Bidder has the option to visit the District work site and familiarize themselves with the local conditions

under which the work is to be performed.

3.2.3 The Bid is based upon the materials, systems and equipment described, without exception, in all Bid

documents supplied by the District.

VARIANCE AND PRICE

Any variance from the specifications in section 8.0.0 of this RFP must be fully explained in writing by the Bidder.

All prices quoted in the Bid must be on a unit price basis and include the total price. The price of an item or unit of a

given product as promised in a Bid cannot be changed by the service provider regardless of whether the District

changes the quantity of the item or unit needed.

MANUFACTURER(S) BRANDS/MODEL NUMBERS

The naming of a manufacturer(s), brand or model number will not be considered as excluding other brands or model

numbers for purposes of later providing the products as promised in the Bid. Specifically, similar products with

comparable construction, material and workmanship will be considered as equal. Notwithstanding, the Board of

Education of the District has complete discretion to evaluate the merits of all Bids submitted and can take into

consideration the brand and/or model numbers set forth in the Bids.

MANUFACTURER(S) SUBSTITUTIONS

Any substitution from the specified products and/or services by the manufacturer(s) is acceptable if at no additional

cost to the District and approved by an authorized district representative prior to placing the order for said products

and/or services. The District reserves the right to refuse any and all manufacturer(s) substituted products and/or

services.

FY2026-NetworkElectronics RFP-260022325

2/20/2026

Any other use of this property requires expressed written permission by Triple R Consultants.

This is the opportunity summary page. It provides an overview of this opportunity and a preview of the attached documentation.