FlipChip Bonding

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Contract Opportunity

SLAC National Accelerator Laboratory is operated by Stanford University for the Department of Energy. As a management and operating contractor, subcontracts awarded by the Laboratory are not Federal procurements, and are not directly subject to the Federal Acquisition Regulations in 48 CFR. Nonetheless, certain Federal laws, Executive Orders, and regulations may affect our DOE approved purchasing system, as required by statute, regulation, or contract terms and conditions.

This is a formal request for quotation from Procurement as requirement has been assigned to me as a buyer.

**Please do not contact the requester regarding the item(s) in this request while we are in the process of bidding to maintain the integrity of this solicitation.

Please review the quote and provide your best and final offer for both price and lead-time.

Kindly also have the quotation revised to today’s date and address the quote to my attention.

The follow has been attached for you to complete and review:

1. (BAA) Buy American Act Certification


2. International Representations & Certifications Rider


3. Confirm Attached SLAC terms are accepted: FP Commercial Supplies-Services T&Cs (August 2023)


4. SOW

Required item(s) listed below:

1. Qty: 45 pieces - product description: 2x3 modules (6 ROC chips per sensor chip)


2. Qty: 15 pieces - product description: 2x2 modules (4 ROC chips per sensor chip)


3. Qty: 15 pieces - product description: 2x1 modules (2 ROC chips per sensor chip)


4. Qty: 45 pieces - product description: 1x1 modules (1 ROC chips per sensor chip)

Quote is for product only; no on-site services permitted.

Source selection will be based on Lowest Price and Technically Acceptable Method (LPTA).

Technical evaluation criteria are as follows:

1. Ability to meet the following specs:

• Adhere to SOW


• Technical Criteria below

1

Bump-to-bump pitch in both dimensions of 100 microns

2

Bump material eutectic SnPb solder

3

Lithography capability on 200mm diameter silicon wafers

4

Lithography capability on 150mm diameter silicon wafers

5

Formation and patterning of polymer passivation film such as BCB on wafers

6

Ability to dice 200mm and 150mm diameter wafers with kerf under 100 microns

7

Ability to flip-chip bond silicon chips up to 4 cm x 6 cm

8

Flip-chip alignment between silicon substrates to within 5 microns in the major plane of the chips

Please provide a price and lead time quotation by COB 4/24/2025. (15 days)

Please be advised that the requirement was also posted on SAM.gov.

Send quote to AnthonyC@SLAC.stanford.edu.

The bid closing date for this requirement is 4/24/2025.

Is there any room for additional discount such as for Academic, ICPT, GSA, or Government Institutions?

If possible, please provide a link to your webpage for published price list to substantiate for the prices quoted.

• Buy American Act Certification (BAA) applies to awards that are over $10,000.


• Representations & Certifications Rider is required. Once completed the Reps and Certs is valid for one year until renewal. If you have already completed one within the year please disregard. Otherwise, please complete and return.


• All subcontractors are required to register in the System for Award Management (www.sam.gov).


• The resulting purchase order will be issued on a fixed price basis. SLAC National Accelerator Laboratory Terms and Conditions for Fixed Price Commercial Supplies and Services (Rev. August 2023) will be made a part of the resulting order.


• Payment Terms will be NET-30


• Freight terms will be FOB Destination Prepaid and Add

You are requested to mark and identify proprietary/confidential information provided in response to the solicitation.

Contact me directly with any questions.

Kind regards,

Anthony Chin

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