TECHNOLOGY/BUSINESS OPPORTUNITY Multimaterial Thixotropic Conductive Elastomeric 3D Printed Materials

Location: California
Posted: Feb 11, 2025
Due: Mar 11, 2025
Agency: ENERGY, DEPARTMENT OF
Type of Government: Federal
Category:
  • 99 - Miscellaneous
Solicitation No: IL-13934
Publication URL: To access bid details, please log in.
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TECHNOLOGY/BUSINESS OPPORTUNITY Multimaterial Thixotropic Conductive Elastomeric 3D Printed Materials
Active
Contract Opportunity
Notice ID
IL-13934
Related Notice
Department/Ind. Agency
ENERGY, DEPARTMENT OF
Sub-tier
ENERGY, DEPARTMENT OF
Office
LLNS – DOE CONTRACTOR
General Information
  • Contract Opportunity Type: Special Notice (Original)
  • Original Published Date: Feb 11, 2025 03:23 pm PST
  • Original Response Date: Mar 11, 2025 05:00 pm PDT
  • Inactive Policy: 15 days after response date
  • Original Inactive Date: Mar 26, 2025
  • Initiative:
Classification
  • Original Set Aside:
  • Product Service Code:
  • NAICS Code:
    • 325211 - Plastics Material and Resin Manufacturing
  • Place of Performance:
    Livermore , CA
    USA
Description

Opportunity:



Lawrence Livermore National Laboratory (LLNL), operated by the Lawrence Livermore National Security (LLNS), LLC under contract no. DE-AC52-07NA27344 (Contract 44) with the U.S. Department of Energy (DOE), is offering the opportunity to enter into a collaboration to further develop and commercialize its Multimaterial Thixotropic Conductive Elastomeric 3D Printed Materials.





Background:



In addition to control of ink architecture DIW 3D printing, allows for the production of functional inks with a variety of special additives. The addition of conductive fillers into a DIW polymer matrix facilitates the transport of electrical charges throughout the composite, resulting in an overall decrease in material resistance. Such conductive elastomeric composites are a largely expanding area of research as replacements for conventional metallic electronics that require complex processing and rigid metals that could damage sensitive structures. Materials for soft electronics, on the other hand, are produced simply through a facile mixing process, devoid of any hazardous chemicals that metal processing typically requires. Also, the compliant nature of many polymer-based materials means that flexible, soft electronics can be safely used in touch-sensitive applications such as robotics, healthcare, or structural component monitoring. One major drawback to these composites is the relatively large amount of conductive filler required to reduce resistance of the composite, typically on the order of >70 wt %, which results in the loss of rheological thixotropy for applications such as 3D printing, as well as a deterioration in mechanical properties.





Description:



LLNL researchers have developed a silicone based conductive, elastomeric 3D DIW printed structure with a lower wt.% conductive, composite filler to allow for the creation of 3D printed lattice structures with tunable conductivity. The conductivity of the printed structure can be varied using composition of the starting DIW ink formulation as well as the 3D printed spacing and density of the resulting printed structure allowing for conductivity response differences depending on directionality of current flow. Furthermore, the elastomeric material properties of the resulting printed structure allow for a conductive response function dependent on the compression or stretching of the physical dimensions of the printed part.





Advantages/Benefits:




  1. Lower wt. % (
  2. Tunable conductivity as a function of ink composition and printed lattice structure.

  3. Directional conductive responsivity dependent on lattice structure spacing and density.

  4. Conductivity responsiveness can be tuned via compression and stretching of the final printed structure.





Potential Applications:




  • Robotics or prosthetics in biomedical applications.

  • Artificial skin

  • Wearable materials for physical motion tracking; could be applicable to physical therapy, sports science, or AR/VR Aka pressure sensor and motion sensors.

  • Dual-purpose foams for cushioning and impact/force detection; could be applicable to automotive or aerospace





Development Status:



Current stage of technology development: TRL ☒ 0-2 ☐ 3-5 ☐ 5-9





LLNL has filed for patent protection on this invention.





LLNL is seeking industry partners with a demonstrated ability to bring such inventions to the market. Moving critical technology beyond the Laboratory to the commercial world helps our licensees gain a competitive edge in the marketplace. All licensing activities are conducted under policies relating to the strict nondisclosure of company proprietary information.





Please visit the IPO website at https://ipo.llnl.gov/resources for more information on working with LLNL and the industrial partnering and technology transfer process.





Note: THIS IS NOT A PROCUREMENT. Companies interested in commercializing LLNL's Multimaterial Thixotropic Conductive Elastomeric 3D Printed Materials should provide an electronic OR written statement of interest, which includes the following:






  1. Company Name and address.

  2. The name, address, and telephone number of a point of contact.

  3. A description of corporate expertise and/or facilities relevant to commercializing this technology.





Please provide a complete electronic OR written statement to ensure consideration of your interest in LLNL's Multimaterial Thixotropic Conductive Elastomeric 3D Printed Materials.





The subject heading in an email response should include the Notice ID and/or the title of LLNL’s Technology/Business Opportunity and directed to the Primary and Secondary Point of Contacts listed below.





Written responses should be directed to:



Lawrence Livermore National Laboratory



Innovation and Partnerships Office



P.O. Box 808, L-779



Livermore, CA 94551-0808



Attention: IL-13934


Attachments/Links
Contact Information
Contracting Office Address
  • 7000 East Avenue
  • Livermore , CA 94551
  • USA
Primary Point of Contact
Secondary Point of Contact
History
  • Feb 11, 2025 03:23 pm PSTSpecial Notice (Original)
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