Sole Source Justification for Micro specimens of electroplated copper films and micro-sized lead-free solder for mechanical testing to fracture
| Location: | Maryland |
|---|---|
| Posted: | May 6, 2026 |
| Agency: | COMMERCE, DEPARTMENT OF |
| Type of Contract: | Awards |
| Type of Government: | Federal |
| Category: |
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| Solicitation No: | To access bid details, please log in. |
| Publication URL: | To access bid details, please log in. |
| Contact information: | To access bid details, please log in. |
| Attachment: | To access bid details, please log in. |
| Bid Description: | To access bid details, please log in. |
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