4H-SiC Silicon Carbide (SiC) Integrated Circuit Processing on 100 mm Diameter SiC Wafers
| Location: |
New York |
| Posted: |
Sep 29, 2025 |
| Agency: |
NATIONAL AERONAUTICS AND SPACE ADMINISTRATION |
| Type of Contract: |
Awards |
| Type of Government: |
Federal |
| Category: |
- A - Research and development
|
| Solicitation No: |
80GRC025C0005 |
| Publication URL: |
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4H-SiC Silicon Carbide (SiC) Integrated Circuit Processing on 100 mm Diameter SiC Wafers
Active
Contract Opportunity
Related Notice
80GRC025R7016_RFP
Contract Line Item Number
Department/Ind. Agency
NATIONAL AERONAUTICS AND SPACE ADMINISTRATION
Sub-tier
NATIONAL AERONAUTICS AND SPACE ADMINISTRATION
Office
NASA GLENN RESEARCH CENTER
Award Details
General Information
-
Contract Opportunity Type: Award Notice (Original)
-
Original Published Date: Sep 29, 2025 02:59 pm EDT
-
Inactive Policy: 15 days after contract award date
-
Original Inactive Date:
Oct 03, 2025
-
Initiative:
Classification
-
Original Set Aside: No Set aside used
-
Product Service Code: AR11 - SPACE R&D SERVICES; SPACE FLIGHT, RESEARCH AND SUPPORTING ACTIVITIES; BASIC RESEARCH
-
NAICS Code:
-
541715 - Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)
-
Place of Performance:
Niskayuna
,
NY
12309
USA
Description
See the attached Source Selection Statement
Attachments/Links
Contact Information
Contracting Office Address
-
21000 BROOKPARK ROAD
-
CLEVELAND , OH 44135
-
USA
Secondary Point of Contact
History
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