Wafer Grinder and CMP Tools

Location: District of Columbia
Posted: Jan 23, 2025
Due: Feb 14, 2025
Agency: DEPT OF DEFENSE
Type of Government: Federal
Category:
  • 36 - Special Industry Machinery
Solicitation No: N0017325QMB04
Publication URL: To access bid details, please log in.
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Wafer Grinder and CMP Tools
Active
Contract Opportunity
Notice ID
N0017325QMB04
Related Notice
N0017325RFIMB08
Department/Ind. Agency
DEPT OF DEFENSE
Sub-tier
DEPT OF THE NAVY
Major Command
ONR
Sub Command
ONR NRL
Office
NAVAL RESEARCH LABORATORY
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General Information View Changes
  • Contract Opportunity Type: Combined Synopsis/Solicitation (Updated)
  • Updated Published Date: Jan 23, 2025 03:44 pm EST
  • Original Published Date: Jan 23, 2025 08:16 am EST
  • Updated Date Offers Due: Feb 14, 2025 12:00 pm EST
  • Original Date Offers Due: Feb 07, 2025 12:00 pm EST
  • Inactive Policy: 15 days after date offers due
  • Updated Inactive Date: Mar 01, 2025
  • Original Inactive Date: Feb 22, 2025
  • Initiative:
    • None
Classification
  • Original Set Aside: Total Small Business Set-Aside (FAR 19.5)
  • Product Service Code: 3670 - SPECIALIZED SEMICONDUCTOR, MICROCIRCUIT, AND PRINTED CIRCUIT BOARD MANUFACTURING MACHINERY
  • NAICS Code:
    • 333242 - Semiconductor Machinery Manufacturing
  • Place of Performance:
    Washington , DC 20375
    USA
Description View Changes

See attached combined Synopsis/Solicitation and System Specifications.



Note; The Government is accepting offers for both new and refurbished hardware. Contractors response needs to specify whether proposing new or refurbished.



Amendment #1 extends the due date for receipt of offers from 2/7/2025 to 2/14/2025.


Attachments/Links
Contact Information
Contracting Office Address
  • 4555 OVERLOOK AVE SW
  • WASHINGTON , DC 20375-5328
  • USA
Primary Point of Contact
Secondary Point of Contact


History

Related Document

Jan 28, 2025[Combined Synopsis/Solicitation (Updated)] Wafer Grinder and CMP Tools
Jan 30, 2025[Combined Synopsis/Solicitation (Updated)] Wafer Grinder and CMP Tools
Jan 31, 2025[Combined Synopsis/Solicitation (Updated)] Wafer Grinder and CMP Tools
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