Wafer Grinder and CMP Tools
| Location: | District of Columbia |
|---|---|
| Posted: | Jan 23, 2025 |
| Due: | Feb 14, 2025 |
| Agency: | DEPT OF DEFENSE |
| Type of Government: | Federal |
| Category: |
|
| Solicitation No: | N0017325QMB04 |
| Publication URL: | To access bid details, please log in. |
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- Contract Opportunity Type: Combined Synopsis/Solicitation (Updated)
- Updated Published Date: Jan 23, 2025 03:44 pm EST
- Original Published Date: Jan 23, 2025 08:16 am EST
- Updated Date Offers Due: Feb 14, 2025 12:00 pm EST
- Original Date Offers Due: Feb 07, 2025 12:00 pm EST
- Inactive Policy: 15 days after date offers due
- Updated Inactive Date: Mar 01, 2025
- Original Inactive Date: Feb 22, 2025
-
Initiative:
- None
- Original Set Aside: Total Small Business Set-Aside (FAR 19.5)
- Product Service Code: 3670 - SPECIALIZED SEMICONDUCTOR, MICROCIRCUIT, AND PRINTED CIRCUIT BOARD MANUFACTURING MACHINERY
-
NAICS Code:
- 333242 - Semiconductor Machinery Manufacturing
-
Place of Performance:
Washington , DC 20375USA
See attached combined Synopsis/Solicitation and System Specifications.
Note; The Government is accepting offers for both new and refurbished hardware. Contractors response needs to specify whether proposing new or refurbished.
Amendment #1 extends the due date for receipt of offers from 2/7/2025 to 2/14/2025.
- 4555 OVERLOOK AVE SW
- WASHINGTON , DC 20375-5328
- USA
- Michael Broomfield
- michael.h.broomfield.civ@us.navy.mil
- Phone Number 2028759785
- Jan 23, 2025 03:44 pm ESTCombined Synopsis/Solicitation (Updated)
- Jan 23, 2025 08:16 am EST Combined Synopsis/Solicitation (Original)
- Jan 03, 2025 02:46 pm EST Sources Sought (Original)
Related Document
| Jan 28, 2025 | [Combined Synopsis/Solicitation (Updated)] Wafer Grinder and CMP Tools |
| Jan 30, 2025 | [Combined Synopsis/Solicitation (Updated)] Wafer Grinder and CMP Tools |
| Jan 31, 2025 | [Combined Synopsis/Solicitation (Updated)] Wafer Grinder and CMP Tools |
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