| Location: | Maryland |
|---|---|
| Posted: | Dec 12, 2025 |
| Due: | Dec 26, 2025 |
| Agency: | COMMERCE, DEPARTMENT OF |
| Type of Government: | Federal |
| Category: |
|
| Solicitation No: | NIST-SS26-CHIPS-49 |
| Publication URL: | To access bid details, please log in. |
***THIS IS A COMBINED SOURCES SOUGHT NOTICE AND NOTICE OF INTENT TO SOLE SOURCE***
The National Institute of Standards and Technology (NIST) Infrastructure and Materials Group within the Engineering Laboratory is seeking an Extreme Thermal Cycling Chamber to perform accelerated aging experiments using rapid thermal cycling as part of a study of long-term reliability of materials used in advanced packaging of semiconductor chips. This work is in support of the CHIPS Metrology program.
The CHIPS Metrology program develops and advances cutting edge metrology capabilities for members of the US semiconductor manufacturing ecosystem. This NIST conducted research program works with device manufacturers, tool vendors, materials suppliers, and other organizations to address critical metrology gaps to spur innovation within seven grand challenge areas. For more information on CHIPS Metrology, please visit https://www.nist.gov/chips/research-development-programs/metrology-program.
The Infrastructure and Materials Group requires the acquisition of a rapid thermal cycling instrument (-100 °C to 200 °C, 70 °C/min). This rapid thermal cycling instrument is essential to our CHIPS project focused on reliability of advanced packaging in heterogeneously integrated semiconductor devices. This capability directly supports the CHIPS R&D Metrology Program’s Grand Challenge to enable metrology for integrating components in advanced packaging. By providing the semiconductor industry with an accurate material property database of polymeric packaging components throughout long-term aging and a new, more accurate reliability model, long-term reliability design efficiency (both time and cost savings) will be greatly improved.
This rapid thermal cycling instrument will allow for accelerated aging at variable ramp rate to study the effect of thermal environment, including direct in-situ temperature and resistance monitoring throughout samples, of polymeric components (e.g., underfills, redistribution layers, and thermal interface materials) used in advanced packaging of heterogeneously integrated semiconductors.
NIST is seeking information from sources that may be capable of providing a solution that will achieve the objectives described above, in addition to the following essential requirements:
Description: Extreme Thermal Cycling Chamber
Quantity: 1
NIST conducted market research from February 2025 through November 2025 by speaking with colleagues, performing internet searches, and speaking with vendors to determine what sources could meet NIST’s minimum requirements. The results of that market research revealed that only ESPEC North America, Inc. (UEI: N61JEZXYKXN5) appears to be capable of meeting NIST’s requirements.
HOW TO RESPOND TO THIS NOTICE
In responding to this notice, please DO NOT PROVIDE PROPRIETARY INFORMATION. Please include only the following information, readable in either Microsoft Word 365, Microsoft Excel 365, or .pdf format, in the response. Submit the response by email to the Primary Point of Contact and, if specified, to the Secondary Point of Contact listed at the bottom of this notice as soon as possible, and preferably before the closing date and time of this notice.
QUESTIONS REGARDING THIS NOTICE
Questions regarding this notice may be submitted via email to the Primary Point of Contact and the Secondary Point of Contact listed in this notice. Questions should be submitted so that they are received with 5 days of this posting. Questions will be anonymized and answered via sources sought notice amendment following the question submission deadline.
IMPORTANT NOTES
The information received in response to this notice will be reviewed and considered so that the NIST may appropriately solicit for its requirements in the near future.
This notice should not be construed as a commitment by the NIST to issue a solicitation or ultimately award a contract.
This notice is not a request for a quotation. Responses will not be considered as proposals or quotations.
No award will be made as a result of this notice.
NIST is not responsible for any costs incurred by the respondents to this notice.
NIST reserves the right to use information provided by respondents for any purpose deemed necessary and appropriate.
Thank you for taking the time to submit a response to this request!

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Bid Due: 6/05/2026