CHIPS High-Throughput High-Resolution X-ray Laminography/Tomography System for Advanced Packaged Semiconductor Devices and Substrates
| Location: | Maryland |
|---|---|
| Posted: | Feb 12, 2026 |
| Due: | Feb 26, 2026 |
| Agency: | COMMERCE, DEPARTMENT OF |
| Type of Government: | Federal |
| Category: |
|
| Solicitation No: | 1333ND26QNB030031 |
| Publication URL: | To access bid details, please log in. |
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- Contract Opportunity Type: Combined Synopsis/Solicitation (Original)
- Original Published Date: Feb 12, 2026 11:42 am EST
- Original Date Offers Due: Feb 26, 2026 11:00 am EST
- Inactive Policy: 15 days after date offers due
- Original Inactive Date: Mar 13, 2026
-
Initiative:
- None
- Original Set Aside:
- Product Service Code: 6640 - LABORATORY EQUIPMENT AND SUPPLIES
-
NAICS Code:
- 334413 - Semiconductor and Related Device Manufacturing
-
Place of Performance:
Gaithersburg , MD 20899USA
See Combined Synopsis Solicitation_1333ND26QNB030031, Attachment 1 - Statement of Work, and Attachment 2 - Applicable Provisions and Clauses attachments for solicitation details.
- ACQUISITION MANAGEMENT DIVISION 100 BUREAU DR.
- GAITHERSBURG , MD 20899
- USA
- Tracy Retterer
- Tracy.retterer@nist.gov
- Donald Collie
- donald.collie@nist.gov
- Feb 12, 2026 11:42 am ESTCombined Synopsis/Solicitation (Original)
- Dec 20, 2025 12:04 am EST Sources Sought (Original)
Related Document
| Feb 24, 2026 | [Combined Synopsis/Solicitation (Updated)] CHIPS High-Throughput High-Resolution X-ray Laminography/Tomography System for Advanced Packaged Semiconductor Devices and Substrates |
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