CHIPS High-Throughput High-Resolution X-ray Laminography/Tomography System for Advanced Packaged Semiconductor Devices and Substrates

Location: Maryland
Posted: Feb 12, 2026
Due: Feb 26, 2026
Agency: COMMERCE, DEPARTMENT OF
Type of Government: Federal
Category:
  • 66 - Instruments and Laboratory Equipment
Solicitation No: 1333ND26QNB030031
Publication URL: To access bid details, please log in.
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CHIPS High-Throughput High-Resolution X-ray Laminography/Tomography System for Advanced Packaged Semiconductor Devices and Substrates
Active
Contract Opportunity
Notice ID
1333ND26QNB030031
Related Notice
NIST-SS26-CHIPS-14
Department/Ind. Agency
COMMERCE, DEPARTMENT OF
Sub-tier
NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY
Office
DEPT OF COMMERCE NIST
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General Information
  • Contract Opportunity Type: Combined Synopsis/Solicitation (Original)
  • Original Published Date: Feb 12, 2026 11:42 am EST
  • Original Date Offers Due: Feb 26, 2026 11:00 am EST
  • Inactive Policy: 15 days after date offers due
  • Original Inactive Date: Mar 13, 2026
  • Initiative:
    • None
Classification
  • Original Set Aside:
  • Product Service Code: 6640 - LABORATORY EQUIPMENT AND SUPPLIES
  • NAICS Code:
    • 334413 - Semiconductor and Related Device Manufacturing
  • Place of Performance:
    Gaithersburg , MD 20899
    USA
Description

See Combined Synopsis Solicitation_1333ND26QNB030031, Attachment 1 - Statement of Work, and Attachment 2 - Applicable Provisions and Clauses attachments for solicitation details.


Attachments/Links
Contact Information
Contracting Office Address
  • ACQUISITION MANAGEMENT DIVISION 100 BUREAU DR.
  • GAITHERSBURG , MD 20899
  • USA
Primary Point of Contact
Secondary Point of Contact
History

Related Document

Feb 24, 2026[Combined Synopsis/Solicitation (Updated)] CHIPS High-Throughput High-Resolution X-ray Laminography/Tomography System for Advanced Packaged Semiconductor Devices and Substrates
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