Micro specimens of electroplated copper films and micro-sized lead-free solder for mechanical testing to fracture - Combined Sources Sought Notice/ Notice of Intent to Sole Source

Location: Colorado
Posted: Nov 21, 2025
Due: Dec 3, 2025
Agency: COMMERCE, DEPARTMENT OF
Type of Government: Federal
Category:
  • A - Research and development
Solicitation No: NIST-SS26-CHIPS-04
Publication URL: To access bid details, please log in.
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Micro specimens of electroplated copper films and micro-sized lead-free solder for mechanical testing to fracture - Combined Sources Sought Notice/ Notice of Intent to Sole Source
Active
Contract Opportunity
Notice ID
NIST-SS26-CHIPS-04
Related Notice
Department/Ind. Agency
COMMERCE, DEPARTMENT OF
Sub-tier
NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY
Office
DEPT OF COMMERCE NIST
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General Information View Changes
  • Contract Opportunity Type: Sources Sought (Updated)
  • Updated Published Date: Nov 20, 2025 04:47 pm EST
  • Original Published Date: Nov 18, 2025 05:02 pm EST
  • Updated Response Date: Dec 03, 2025 05:00 pm EST
  • Original Response Date: Dec 03, 2025 05:00 pm EST
  • Inactive Policy: 15 days after response date
  • Updated Inactive Date: Dec 18, 2025
  • Original Inactive Date: Dec 18, 2025
  • Initiative:
    • None
Classification
  • Original Set Aside: No Set aside used
  • Product Service Code: AJ12 - GENERAL SCIENCE AND TECHNOLOGY R&D SERVICES; GENERAL SCIENCE AND TECHNOLOGY; APPLIED RESEARCH
  • NAICS Code:
    • 541713 - Research and Development in Nanotechnology
  • Place of Performance:
    Boulder , CO 80305
    USA
Description View Changes

Please see attached Combined Sources Sought Notice (SSN)/Notice of Intent to Sole Source # NIST-SS26-CHIPS-04 for full details.


Attachments/Links
Contact Information View Changes
Contracting Office Address
  • ACQUISITION MANAGEMENT DIVISION 100 BUREAU DR.
  • GAITHERSBURG , MD 20899
  • USA
Primary Point of Contact
Secondary Point of Contact
History

Related Document

Nov 18, 2025[Sources Sought (Original)] Micro specimens of electroplated copper films and micro-sized lead-free solder for mechanical testing to fracture
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